Microelectronic interconnect adaptor
AssigneeIntel Corporation
InventorsChristian Geissler, Klaus Reingruber, Sven Albers
Life of this patent
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Abstract
An interconnect adaptor may be fabricated having a substantially planar surface, to which a microelectronic package may be electrically attached, and a non-planar surface with at least one interconnect extending from the interconnect adaptor planar surface to the interconnect adaptor non-planar surface. The interconnect adaptor non-planar surface may be shaped to substantially conform to a shape of a microelectronic substrate to which it may be attached, which eliminates the need to bend or otherwise adapt the microelectronic package to conform to the microelectronic substrate.
Claims24
A microelectronic component comprising an interconnect adaptor having a substantially planar surface and a non-planar surface with at least one electrically conductive interconnect extending from the planar surface to the non-planar surface.
-21. (canceled)
An electronic system, comprising:
- a board;
- and
- a microelectronic component including:
- an interconnect adaptor having a substantially planar surface and a non-planar surface with at least one electrically conductive interconnect extending from the planar surface to the non-planar surface;
- and
- a microelectronic package attached to the interconnect adaptor planar surface;
- wherein the microelectronic component is electrically attached to the board by connectors extending from the interconnect adaptor non-planar surface.
Dependencies are inferred from the claim text.