Method for Moulding and Surface Processing Electronic Components and Electronic Component Produced with this Method
AssigneeBesi Netherlands B.V.
InventorWilhelmus Gerardus Jozef Gal
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Abstract
The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed. The invention also relates to a partial encapsulated electronic component as produced with such a method.
Claims11
A method for moulding and surface processing electronic components by the successive processing steps of:
- A) attaching a grid of electronic components on a carrier;
- B) placing a foil against the side of the electronic components opposite to the carrier;
- C) enclosing the foil covert electronic components on the carrier with a mould cavity;
- D) feeding to the mould cavity an encapsulating material;
- E) at least partial hardening of the encapsulating material fed to the mould cavity;
- F) removing from the mould cavity the partial encapsulated electronic components attached to the carrier;
- G) removing the foil from the partial encapsulated electronic components attached to the carrier;
- H) providing at least one surface influencing process to the free side of the components attached to the carrier;
- and
- I) loosening the partial encapsulated and surface processed electronic components from the carrier.
Dependencies are inferred from the claim text.