Underfill process and processing machine thereof

A processing machine of an underfill process, the processing machine comprising:

• a carrier, for carrying a package substrate provided with a plurality chips bonded thereon;
• an automated device, having a dispenser for filling an underfill between each of the chips and the package substrate;
• a scanning mechanism, configured on the carrier;
• an identifying device, driven by the scanning mechanism to move along a predetermined path over the package substrate and identify positions of the chips before the dispenser fills the underfill between each of the chips and the package substrate, wherein the identifying device is suitable for outputting an identifying result of chip position, and a movement of the identifying device is independent from a movement of the dispenser;
• and
• a host, electrically connected to the automated device and the identifying device, the host receiving the identifying result and locating the dispenser of the automated device according to the identifying result when filling the underfill between each of the chips and the package substrate.