Plasma processing apparatus and method for manufacturing electronic component
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTetsuhiro IWAI, Shogo OKITA, Syouzou WATANABE
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Abstract
A plasma processing apparatus performs plasma processing on a substrate held by a carrier. The carrier includes a frame disposed around the substrate and a holding sheet which holds the substrate and the frame. The plasma processing apparatus includes: a chamber; a stage which is disposed within the chamber and has an upper surface on which the carrier is mounted; a gas hole which is provided at a position of the upper surface opposing a bottom surface of the frame and through which cooling gas is supplied between the stage and the carrier; and a plasma exciting unit which generates plasma within the chamber.
Claims10
A plasma processing apparatus which performs plasma processing on a substrate held by a carrier which comprises a frame disposed around the substrate and a holding sheet which holds the substrate and the frame, said plasma processing apparatus comprising:
- a chamber;
- a stage which is disposed within the chamber and has an upper surface on which the carrier is mounted;
- a gas hole which is provided at a position of the upper surface opposing a bottom surface of the frame and through which cooling gas is supplied between the stage and the carrier;
- and
- a plasma exciting unit which generates plasma within the chamber.
A method for manufacturing an electronic component using a plasma processing apparatus which comprises a chamber, a stage disposed within the chamber, a gas hole provided at an upper surface of the stage, and a plasma exciting unit, said method comprising:
- preparing a carrier which holds a substrate as a start material of electronic components;
- mounting the carrier, which holds the substrate, on the upper surface of the stage;
- supplying cooling gas from the gas hole between the stage and the carrier after the carrier is mounted on the upper surface of the stage;
- and
- performing plasma processing on the substrate using plasma generated within the chamber by the plasma exciting unit after the carrier is mounted on the upper surface of the stage, thereby obtaining the electronic components,
- wherein the carrier comprises a frame disposed around the substrate and a holding sheet which holds the substrate and the frame, and
- wherein the gas hole is provided at a portion of the upper surface of the stage opposing a bottom surface of the frame.
Dependencies are inferred from the claim text.