Semiconductor device package with mirror mode

A memory device package, comprising:

• a first package contact configured to receive a switch signal;
• a plurality of second package contacts;
• and
• a memory die coupled to the first and second package contacts, the memory die configured to assign the second package contacts to either a first arrangement of corresponding pin assignments or a second arrangement of corresponding pin assignments based on the switch signal.

A method of manufacturing a memory device assembly, the method comprising:

• attaching first package contacts of a first semiconductor device package to a first side of a support substrate, the first package contacts assigned to a first arrangement of corresponding pin assignments;
• attaching second package contacts of a second semiconductor device package to a second side of a support substrate opposite the first side, the second package includes a switch circuit configured to receive a switch signal and to assign the second package contacts to either the first arrangement of corresponding pin assignments or a second arrangement of corresponding pin assignments based on the switch signal;
• and
• bonding a third package contact of the second semiconductor device package to a bond pad configured to provide the switch signal.