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US 2016/0239057 A1Published application
Electronic devices and method of controlling an electronic device
AssigneeIntel IP Corporation
InventorKenan Kocagoez
Life of this patent
Estimating the term…
Abstract
An electronic device is provided. The electronic device may include a plurality of electronic circuits comprising a first electronic circuit and a second electronic circuit; and a processor configured to control at least one of the first electronic circuit or the second electronic circuit depending on at least one parameter indicating thermal properties of the first electronic circuit and a predetermined parameter indicating a thermal interdependency between the first electronic circuit and the second electronic circuit.
Claims20
An electronic device, comprising:
- a plurality of electronic circuits comprising a first electronic circuit and a second electronic circuit;
- and
- a processor configured to control at least one of the first electronic circuit or the second electronic circuit depending on at least one parameter indicating thermal properties of the first electronic circuit and a predetermined parameter indicating a thermal interdependency between the first electronic circuit and the second electronic circuit.
An electronic device, comprising:
- a plurality of electronic circuits;
- a processor configured to control at least one electronic circuit of the plurality of electronic circuits depending on a determined temperature of at least one further electronic circuit of the plurality of electronic circuits and the thermal interaction of the at least one electronic circuit with the at least one further electronic circuit.
An electronic device, comprising:
- a plurality of chip modules;
- a memory configured to store information about self-heating of each chip module of the plurality of chip modules and information about cross-heating of the chip modules indicating the temperature influence of a respective chip module to one or more other chip modules;
- a processor configured to control the temperature of at least one chip module based on the stored information about self-heating of the at least one chip module and the stored information about cross-heating of the chip modules.
Dependencies are inferred from the claim text.