Uv-patternable hard-coating for transparent conductive film
AssigneeCovestro Deutschland AG
InventorsAxel SCHMIDT, Susan Lu TIAN, Lily Liqi YANG, Shao Quiang TANG
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Abstract
The present invention relates to the substrates with UV-patternable hard-coating (UPHC) with, either on top or below the transparent conductive materials such as transparent conductive oxides (TCO), conductive polymers, carbon or metal based nanomaterials and nanocomposites, the process for its preparation and articles that comprise said substrates.
Claims13
-12. (canceled)
A coated substrate comprising at least one transparent conductive material layer and at least one UV-patternable hard-coating layer, wherein the hard-coating layer is a block-resistant thermoplastic layer and is end-cured by actinic radiation comprising:
- A) one or more monomeric or polymeric compounds that carry at least one functional group, that react with ethylenically unsaturated compounds under the action of actinic radiation, with polymerization, which compounds
- A1) contain at least one chemical function a) suitable for polyaddition with component B) and different from b) and/or
- A2) do not contain chemical function a) and optionally
- B) one or more compounds containing at least one chemical function b) suitable for polyaddition with component A1) and different from a), which compounds
- B1) do not contain ethylenically unsaturated double bonds and/or
- B2) contain ethylenically unsaturated double bonds and
- C) silica nanoparticles,
- D) photoinitiators,
- E) additives such as stabilisers, catalysts, wetting agents and other auxiliary substances and additives,
- F) non-functional polymers and/or fillers,
- wherein the substrate comprises conductive areas and non-conductive areas that form patterns and at least one of the coating layers has a pattern.
A process for the preparation of a coated substrate with at least one transparent conductive material layer and at least one hard-coating layer, wherein the hard-coating layer is a block-resistant thermoplastic layer comprising:
- A) one or more monomeric or polymeric compounds that carry at least one functional group, that react with ethylenically unsaturated compounds under the action of actinic radiation, with polymerization, which compounds
- A1) contain at least one chemical function a) suitable for polyaddition with component B) and different from b) and/or
- A2) do not contain chemical function a) and optionally
- B) one or more compounds containing at least one chemical function b) suitable for polyaddition with component A1) and different from a), which compounds
- B1) do not contain ethylenically unsaturated double bonds and/or
- B2) contain ethylenically unsaturated double bonds and
- C) silica nanoparticles,
- D) photoinitiators,
- E) additives such as stabilisers, catalysts, wetting agents and other auxiliary substances and additives,
- F) non-functional polymers and/or fillers, comprising the steps in the following sequence:
- (a) coating said substrate with a transparent conductive material,
- (b) coating said transparent conductive material with a hard-coating precursor,
- (c) thermally curing said hard-coating precursor,
- (d) patterning said thermally cured hard-coating by applying a physical mask on the top surface during end-curing with actinic radiation and
- (e) subsequent solvent washing of the coated substrate.
A process for the preparation of a coated substrate with at least one transparent conductive material layer and at least one hard-coating layer, wherein the hard-coating layer is a block-resistant thermoplastic layer comprising:
- A) one or more monomeric or polymeric compounds that carry at least one functional group, that react with ethylenically unsaturated compounds under the action of actinic radiation, with polymerization, which compounds
- A1) contain at least one chemical function a) suitable for polyaddition with component B) and different from b) and/or
- A2) do not contain chemical function a) and optionally
- B) one or more compounds containing at least one chemical function b) suitable for polyaddition with component A1) and different from a), which compounds
- B1) do not contain ethylenically unsaturated double bonds and/or
- B2) contain ethylenically unsaturated double bonds and
- C) silica nanoparticles,
- D) photoinitiators,
- E) additives such as stabilisers, catalysts, wetting agents and other auxiliary substances and additives,
- F) non-functional polymers and/or fillers, comprising the steps in the following sequence:
- (a1) coating said substrate with a hard-coating precursor,
- (b1) thermally curing said hard-coating precursor,
- (c1) coating said thermally cured hard-coating with a transparent conductive material,
- (d1) patterning said thermally cured hard-coating by applying a physical mask on the top surface during end-curing with actinic radiation
- (e 1) and subsequent solvent washing of the coated substrate or
- (f1) coating said substrate with a hard-coating precursor,
- (g1) thermally curing said hard-coating precursor,
- (h1) patterning said thermally cured hard-coating by applying a physical mask on the top surface during end-curing with actinic radiation,
- (i1) subsequent solvent washing of the coated substrate and
- (j1) coating said thermally cured hard-coating with a transparent conductive material.
Dependencies are inferred from the claim text.