Hermetic optical fiber alignment assembly having integrated optical element

A modified transistor outline (TO)-can assembly comprising:

• a header having at least an upper surface and a lower surface;
• an optical subassembly (OSA) disposed on the upper surface of the header, the OSA including at least an optoelectronic device;
• a cap having at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the cap defining a side wall of the cap, a portion of the lower surface of the cap being mechanically coupled to a portion of the upper surface of the header;
• a window having at least an upper surface and a lower surface, the upper surface of the window being mechanically coupled to the inner surface of the cap about a peripheral portion of the window, the window being transparent to an operational wavelength of the optoelectronic device;
• a collar having at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the collar defining a side wall of the collar, wherein a portion of the lower surface of the collar is mechanically coupled to a portion of the upper surface of the cap;
• and
• a receptacle having at least a top surface, a bottom surface and an outer wall, a portion of the outer wall of the receptacle being mechanically coupled to a portion of the inner surface of the collar, wherein the bottom surface of the receptacle has a groove formed in it having a length-wise axis, the groove being adapted to receive a portion of an optical fiber that is passed through an opening formed in the outer wall of the receptacle and an opening formed in the side wall of the collar and wherein the portion of the optical fiber has an optical axis that is parallel to the length-wise axis of the groove, the length-wise axis of the groove being at a non-zero degree angle, α, to an axis of the modified TO-can assembly that is generally normal to the upper surface and lower surface of the collar and the top surface and bottom surface of the receptacle.

A modified transistor-outline (TO)-can assembly comprising:

• a header having at least an upper surface and a lower surface, the lower surface of the header corresponding to the lower surface of the modified TO-can assembly;
• an optical subassembly (OSA) disposed on the upper surface of the header, the OSA including at least an optoelectronic device;
• a collar having at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the collar defining a side wall of the collar;
• a receptacle having at least a top surface, a bottom surface, and an outer wall, wherein the outer wall defines a side wall of the receptacle, wherein a portion of the outer wall of the receptacle is mechanically coupled to a portion of the inner surface of the collar, and wherein an opening is formed in the side wall of the collar and an opening is formed in the side wall of the receptacle for receiving a portion of an optical fiber in the modified TO-can assembly at a non-zero degree angle, α, relative to an axis of the modified TO-can assembly that is generally normal to the upper surface and lower surface of the collar and the top surface and bottom surface of the receptacle, and wherein the portion of the optical fiber that is received by the opening in the side wall of the receptacle is affixed to the bottom surface of the receptacle;
• a cap having at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the cap defining a side wall of the cap, a portion of the lower surface of the cap being mechanically coupled to a portion of the upper surface of the header, wherein a portion of the lower surface of the collar is mechanically coupled to a portion of the upper surface of the cap;
• and
• a window having at least an upper surface and a lower surface, the upper surface of the window being mechanically coupled to the inner surface of the cap about a peripheral portion of the window, the window being transparent to an operational wavelength of the optoelectronic device.

An optoelectronic module assembly comprising:

• a housing;
• wherein a base portion of the housing has at least an upper surface and a lower surface, the lower surface of the base portion corresponding to the lower surface of the optoelectronic module assembly;
• an optoelectronic device assembly disposed on the upper surface of the base portion, the optoelectronic device assembly including at least an optoelectronic device;
• wherein a coupling portion of the housing has at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the coupling portion defining a side wall of the coupling portion;
• an optical fiber alignment assembly having at least a top surface, a bottom surface, and an outer wall, wherein the outer wall defines a side wall of the optical fiber alignment assembly, wherein a portion of the outer wall of the optical fiber alignment assembly is coupled to a portion of the inner surface of the coupling portion, and wherein an opening is formed in the side wall of the coupling portion and an opening is formed in the side wall of the optical fiber alignment assembly for receiving a portion of an optical fiber in the optoelectronic module assembly at a non-zero degree angle, α, relative to an axis of the optoelectronic module assembly that is generally normal to the upper surface and lower surface of the coupling portion and the top surface and bottom surface of the optical fiber alignment assembly, and wherein the portion of the optical fiber that is received by the opening in the side wall of the optical fiber alignment assembly is affixed to the bottom surface of the optical fiber alignment assembly;
• wherein a wall portion of the housing has at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the wall portion defining a side wall of the wall portion of the housing, a portion of the lower surface of the wall portion being coupled to a portion of the upper surface of the base portion, wherein a portion of the lower surface of the coupling portion is coupled to a portion of the upper surface of the wall portion;
• and
• a space within the housing defined between at least an upper surface and a lower surface, the upper surface of the space extends to the inner surface of the wall portion about a peripheral portion of the space, the space being transparent to an operational wavelength of the optoelectronic device.

An optoelectronic module assembly comprising:

• a housing;
• wherein a base portion of the housing having at least an upper surface and a lower surface;
• an optoelectronic device assembly disposed on the upper surface of the base portion, the optoelectronic device assembly including at least an optoelectronic device;
• wherein a wall portion of the housing has at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the wall portion defining a side wall of the wall portion, a portion of the lower surface of the wall portion being coupled to a portion of the upper surface of the base portion;
• a space within the housing defined between at least an upper surface and a lower surface, the upper surface of the space extends to the inner surface of the wall portion about a peripheral portion of the space, the space being transparent to an operational wavelength of the optoelectronic device;
• wherein a coupling portion of the housing has at least an upper surface, a lower surface, an inner surface, and an outer surface, the inner and outer surfaces of the coupling portion defining a side wall of the coupling portion, wherein a portion of the lower surface of the coupling portion is coupled to a portion of the upper surface of the wall portion;
• and
• an optical fiber alignment assembly having at least a top surface, a bottom surface and an outer wall, wherein a portion of the outer wall of the optical fiber alignment assembly being coupled to a portion of the inner surface of the coupling portion, wherein the bottom surface of the optical fiber alignment assembly has a groove formed in it having a length-wise axis, the groove being adapted to receive a portion of an optical fiber that is passed through an opening formed in the outer wall of the optical fiber alignment assembly and an opening formed in the side wall of the coupling portion and wherein the portion of the optical fiber has an optical axis that is parallel to the length-wise axis of the groove, the length-wise axis of the groove being at a non-zero degree angle, α, to an axis of the optoelectronic module assembly that is generally normal to the upper surface and lower surface of the coupling portion and the top surface and bottom surface of the optical fiber alignment assembly.