Detecting method for improving resolution of area array probe
AssigneeNDT Technology (Shanghai) Co., Ltd.
InventorRui ZHANG
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AssigneeNDT Technology (Shanghai) Co., Ltd.
InventorRui ZHANG
Estimating the term…
The invention provides a detecting method for improving a resolution ratio of an area array probe. The detecting method comprises the following steps: firstly, an ultrasonic area array probe is provided with N wafers that are arranged in the form of an area array; secondly, controlling a wafer a to send m impulse waves toward a to-be-detected workpiece through a chip; thirdly, successively respectively receiving the impulse waves reflected by the to-be-detected workpiece through a wafer and adjacent (m−1) wafers of the wafer; fourthly, when the N chips all send the m impulse waves, and fully receiving the impulse waves reflected by the to-be-detected workpiece; fifthly, repeating the previous four steps until flaw detection is finished; and lastly, obtaining a defect diagram of the to-be-detected workpiece by analytical processing of the impulse waves received by a main engine, displaying through a displayer arranged on the main engine.
A detection method capable of improving a resolution of an area array probe, comprising the following steps:
The detection method capable of improving the resolution of the area array probe of any one of claims 1-5, wherein the N wafers refer to 52 wafers.
Dependencies are inferred from the claim text.