Led lighting unit
AssigneeFlextronics AP, LLC
InventorEarl James Hayes
Life of this patent
Estimating the term…
Abstract
An LED lighting unit may include a flexible circuit substrate having a an obverse side and a reverse side. The obverse side may include a plurality of mounting points for LEDs and the reverse side may include a thermal conduction material. A plurality of LEDs may be mounted to the plurality of mounting points and may be in thermal communication with the thermal conduction material. A heat sink may be attached to the reverse side of the substrate and may have a hollow conical-frustum geometry. The heat sink may include a top circumference, a bottom circumference, a top opening, a bottom opening, at least one cooling fin extending into an interior of the heat sink.
Claims20
A lighting unit comprising:
- a flexible circuit substrate having a an obverse side and a reverse side, the obverse side including a plurality of mounting points for light emitting diodes (LEDs) and the reverse side including a thermal conduction material;
- a plurality of LEDs mounted to the plurality of mounting points and in thermal communication with the thermal conduction material;
- a heat sink having a hollow conical-frustum geometry, a top circumference, a bottom circumference, a top opening, a bottom opening, at least one cooling fin extending into an interior of the heat sink, and an exterior surface which is attached to the reverse side of the substrate.
A lighting unit comprising:
- a circuit substrate having an obverse side which includes a plurality of mounting points for light emitting diodes (LEDs);
- and
- a heat sink having a hollow geometry which includes at least one cooling fin projecting into an interior of the heat sink and an exterior surface which is bonded to a reverse side of the substrate;
A method for heat dissipation in a lighting unit which comprises:
- providing a flexible circuit substrate having a an obverse side and a reverse side, the obverse side including a plurality of mounting points for light emitting diodes (LEDs) and the reverse side including a thermal conduction material;
- mounting a plurality of LEDs to the plurality of mounting points and in thermal communication with the thermal conduction material;
- and
- attaching a heat sink to a the reverse side of the substrate, the heat sink having a hollow conical-frustum geometry, a top circumference, a bottom circumference, a top opening, a bottom opening, at least one cooling fin extending into an interior of the heat sink.
Dependencies are inferred from the claim text.