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US 2016/0237569 A1Published application
Semiconductor manufacturing apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsHideaki MASUDA, Katsuyasu SHIBA
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Abstract
A semiconductor manufacturing apparatus according to an embodiment includes a heater, a sidewall, and a moving mechanism. The heater is capable of heating a semiconductor substrate. The sidewall is located at an outer edge of the heater and protrudes upward from a mount face of the heater on which the semiconductor substrate is mounted. The moving mechanism relatively moves at least a part of the sidewall and the heater in a substantially perpendicular direction with respect to the mount face.
Claims17
A semiconductor manufacturing apparatus comprising:
- a heater capable of heating a semiconductor substrate;
- a sidewall located at an outer edge of the heater and protruding upward from a mount face of the heater on which the semiconductor substrate is mounted;
- and
- a moving mechanism relatively moving at least a part of the sidewall and the heater in a substantially perpendicular direction with respect to the mount face.
1 more element
Dependencies are inferred from the claim text.