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US 2016/0237288 A1Published application
Sheet for sealing and method for manufacturing semiconductor device
OwnerGoji Shiga, Koji Mizunoinventors
Life of this patent
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Abstract
Provided is a sheet for sealing in which a semiconductor chip is to be embedded, and a surface of the sheet has a surface specific resistance value of 1.0×1012Ω or less.
Claims4
A sheet for sealing in which a semiconductor chip is to be embedded,
- a surface of the sheet having a surface specific resistance value of 1.0×1012Ω or less.
A method for manufacturing a semiconductor device, comprising:
- a step A of fixing a semiconductor chip onto a support, and
- a step B of embedding the semiconductor chip fixed onto the support in a sheet for sealing to form a sealed body,
- wherein a surface of the sheet for sealing has a surface specific resistance value of 1.0×1012Ω or less.
Dependencies are inferred from the claim text.