Microfluidic delivery member with filter and method of forming same
AssigneesSTMicroelectronics S.r.l., STMicroelectronics Asia Pacific Pte Ltd
InventorsSimon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
Life of this patent
Estimating the term…
Abstract
Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Claims22
A method comprising:
- securing a plurality of filters to a first surface of a printed circuit board strip, the plurality of filters covering a plurality of through holes, respectively, in the printed circuit board;
- and
- securing a plurality of semiconductor dice to a second, opposite surface of the printed circuit board strip, the plurality of semiconductor dice covering the plurality of through holes, respectively, the plurality of semiconductor dice including an inlet path in fluid communication with the plurality of through holes, respectively, and having nozzles for expelling a fluid.
A method comprising:
- coupling a filter to a first surface of a printed circuit board so that the filter is located over a through hole in the printed circuit board;
- and
- coupling a semiconductor die to the filter, the semiconductor die including an inlet path, wherein upon coupling the filter to the first surface of the printed circuit board and coupling the semiconductor die to the filter, the inlet path of the semiconductor die is located over the through hole in the printed circuit board.
A microfluidic delivery member comprising:
- a printed circuit board having first and second surfaces, the printed circuit board including a through hole that extends from the first surface to the second surface;
- a liner in the through hole;
- and
- a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the first surface of the printed circuit board with the inlet path in fluidic communication with the through hole of the printed circuit board, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path, the plurality of nozzles being configured to expel a fluid received through the through hole of the printed circuit board.
Dependencies are inferred from the claim text.