Abrasive grindstone
AssigneeDisco Corporation
InventorsRyuji Oshima, Ryogo Maji
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Abstract
An abrasive grindstone for grinding a workpiece is disclosed. The abrasive grindstone includes diamond abrasive grains and a boron compound. The diamond abrasive grains and the boron compound are compounded at a predetermined volume ratio. The average grain size Y of the diamond abrasive grains is set to 0 μm<Y≦50 μm. The average grain size ratio Z of the boron compound to the diamond abrasive grains is set to 0.8≦Z≦3.0. Preferably, the workpiece is a silicon wafer, and the average grain size ratio Z is set to 0.8≦Z≦2.0.
Claims4
An abrasive grindstone for grinding a workpiece, comprising diamond abrasive grains and a boron compound;
- said diamond abrasive grains and said boron compound being compounded at a predetermined volume ratio;
- an average grain size Y of said diamond abrasive grains being set to 0 μm<Y≦50 μm;
- an average grain size ratio Z of said boron compound to said diamond abrasive grains being set to 0.8≦Z≦3.0.
Dependencies are inferred from the claim text.