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US 2016/0236318 A1Published application
Polishing head and polishing carrier apparatus having the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYun-Seok CHOI, Chang-Gil RYU, Geun-Young SONG, Ki-Yeon CHU, Jin-Suk HONG
Life of this patent
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Abstract
A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.
Claims20
A polishing head, comprising:
- a substrate carrier to suck and to pressurize a substrate;
- and
- a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.
A retainer ring, comprising:
- an annular body having an upper surface fixed to a lower surface of a substrate carrier and a lower surface contacting and pressing a polishing pad;
- and
- a cooling channel extending through the body and circulating a coolant fluid therethrough.
A polishing head, comprising:
- a substrate carrier to suck and to pressurize a substrate;
- and
- a retainer ring connected to a bottom of the substrate carrier and surrounding a circumference of the substrate, the retainer ring including a cooling channel therethrough that is in fluid communication with a coolant fluid supply unit external to the polishing head.
Dependencies are inferred from the claim text.