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US 2016/0235564 A1Published application
Three-dimensional thin-film nitinol devices
AssigneeNSVascular, Inc.
InventorsAlfred David Johnson, Colin Kealey
Life of this patent
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Abstract
A method of manufacturing three-dimensional thin-film nitinol (NiTi) devices includes: depositing multiple layers of nitinol and sacrificial material on a substrate. A three-dimensional thin-film nitinol device may include a first layer of nitinol and a second layer of nitinol bonded to the first layer at an area masked and not covered by the sacrificial material during deposition of the second layer.
Claims17
A method comprising:
- deep reactive ion etching a pattern of grooves on a surface of a semiconductor substrate, the grooves corresponding to fenestrations in a desired three-dimensional nitinol structure;
- depositing a lift-off layer on the grooved semiconductor substrate surface;
- depositing a first NiTi layer over the lift-off layer;
- depositing a sacrificial layer to partially cover the first NiTi layer, the sacrificial layer corresponding to a lumen in the desired three-dimensional nitinol structure;
- and
- depositing a second NiTi layer over the sacrificial layer.
3 more elements
A nitinol stent cover, comprising:
- a first nitinol layer;
- an aluminum bonding layer;
- and
- a second nitinol layer, wherein the aluminum bonding layer is configured to bond longitudinal edges of the first nitinol layer to longitudinal edges of the second nitinol layer.
1 more element
Dependencies are inferred from the claim text.