US 2016/0229990 A1Published application

Thermosetting resin composition and uses thereof

AssigneeShengyi Technology Co., Ltd.

InventorsCuiming DU, Liangpeng HAO, Songgang CHAI

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Abstract

A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

Claims20

Dependent claims

A thermosetting resin composition, wherein the thermosetting resin composition comprises a thermosetting resin, an inorganic filler, and an organomolybdenum compound.

Dependencies are inferred from the claim text.

Facts

Application: 15/028,578Filed 11 Oct 2013
Published: 11 Aug 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification58 codes

C08K 5/5398
Phosphorus-containing compounds: phosphorus bound to sulfur
B32B 7/10
Interconnection of layers: at least one layer having inter-reactive properties
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 15/20
Layered products comprising a layer of metal: comprising aluminium or copper

Family

US 10,208,188 B2Related patent
US 2016/0229990 A1This patent

From the US filing history. Foreign family members aren’t listed.

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