Bonding Pad Surface Damage Reduction in a Formation of Digital Pattern Generator
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih Wei Lu, Tsung-Chih Chien, Hui-Min Huang, Tien-I Bao
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Abstract
A method of fabricating a Digital pattern generator (DPG) device is disclosed. The method includes forming an etch-stop-layer (ESL) over a bonding pad in a first region over a substrate, forming a pixel well in the second region over the substrate, forming an anti-charging layer over the bonding pad and along sidewalls of the pixel well. The bonding pad is covered by the ESL during the forming of the anti-charging layer over the bonding pad. The method also includes removing the anti-charging layer over the bonding pad. Therefore, after removing the anti-charging layer over the bonding pad, the bonding pad remains covered by the ESL.
Claims21
A method comprising:
- providing a substrate having a circuit region and a pixel region, wherein the circuit region includes a bonding pad disposed over an interconnect structure and the pixel region includes an insulating layer having a base electrode embedded in the insulating layer;
- forming an etch-stop-layer (ESL) over the bonding pad in the first region such that the bonding pad is covered by the ESL;
- forming a pixel well in the second region that extends through the insulating layer to expose the base electrode;
- forming an anti-charging layer over the bonding pad and along sidewalls of the pixel well, wherein the bonding pad is covered by the ESL during the forming of the anti-charging layer over the bonding pad;
- and
- removing the anti-charging layer over the bonding pad, wherein after removing the anti-charging layer over the bonding pad, the bonding pad remains covered by the ESL.
A method comprising:
- providing a substrate having a bonding pad in a first region;
- forming an etch-stop-layer (ESL) in the first region, including wrapping over a top surface and sidewalls of the bonding pad;
- forming a passivation layer over the ESL, having an opening to expose a portion of the ESL over the top surface of the bonding pad;
- forming a pixel well in a second region of the substrate;
- depositing an anti-charging layer over the substrate, including along sidewalls of the pixel well;
- and
- removing the anti-charging layer in the first region with the ESL to protect the top surface of the bonding pad.
18-20. (canceled)
A method comprising:
- forming a first region in a substrate, the first region including a pixel well and an anti-charging layer along sidewalls of the pixel well;
- forming a second region in the substrate, the second region including a bonding pad, an etch-stop-layer (ESL) along sidewalls of the bonding pad, including extending to wrap over edges of a top surface of the bonding pad, and a passivation layer over the ESL, wherein a portion of a top surface of the bonding pad is not covered by the passivation layer and the ESL, and wherein the portion of the top surface of the bonding pad has an uniform surface.
Dependencies are inferred from the claim text.