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US 2016/0207286 A1Published application
Composite and multilayered silver films for joining electrical and mechanical components
AssigneeAlpha Metals, Inc.
InventorsOscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
Life of this patent
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Abstract
Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
Claims15
A silver film comprising a mixture of silver and reinforcing (modifying) particles.
Dependencies are inferred from the claim text.