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US 2016/0197761 A1Published application
Multi-band interconnect for inter-chip and intra-chip communications
AssigneeThe Regents of the University of California
InventorsMau-Chung Chang, Sai-Wang Tam, Gyung-Su Byun, Yanghyo Kim, Kanit Therdsteerasukdi, Jeremy Ir, Glenn Reinman, Jingsheng Cong
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Abstract
Systems, apparatus, modules, and methods of communicating with memory devices utilizing multi-band communication containing a baseband and one or more amplitude shift keyed (ASK) RF channels over each differential pair of off-chip transmission lines. Configurations are described for interfacing between microprocessors, or controllers and memory devices or modules, and within a DIMM and its DRAM devices, and between multiple DIMM memory modules.
Claims1
An apparatus for memory interfacing, comprising:
- a baseband transmitter at a first frequency within a first integrated circuit configured for connection to a transmission line adapted for connection to at least a second integrated circuit;
- wherein said baseband transmitter is configured for outputting a baseband signal in response to receipt of a first data stream within said first integrated circuit;
- and
- at least one RF transmitter having a carrier at a second frequency which is amplitude shift keyed (ASK) and configured for connection to said transmission line;
- wherein multiple bands are simultaneously communicated from said first integrated circuit to at least said second integrated circuit.
2 more elements
Dependencies are inferred from the claim text.