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US 2016/0197597 A1Published application
Vibration device and manufacturing method of the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsHiroshi Yamada, Keiichi Umeda, Takehiko Kishi, Toshio Nishimura
Life of this patent
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Abstract
A vibration device that includes a support member, vibration arms connected to the support member and each having an n-type Si layer which is a degenerate semiconductor, and electrodes provided so as to excite the vibration arms, and silicon oxide films containing impurities in contact with a respective lower surface of the n-type Si layers of each vibration arm.
Claims19
A vibration device comprising:
- a support member;
- at least one vibration body connected to the support member and including an n-type Si layer which is a degenerate semiconductor;
- an electrode positioned to excite the vibration body;
- and
- a first silicon oxide film containing impurities in contact with a first surface of the n-type Si layer.
2 more elements
A method of manufacturing a vibration device, the method comprising:
- preparing a vibration body that is connected to a support member, the vibration body including an n-type Si layer having opposed first and second surfaces, a first silicon oxide film containing impurities provided on the first surface of the n-type Si layer, and a second silicon oxide film containing impurities provided on the second surface of the n-type Si layer, and
- forming an electrode so as to excite the vibration body.
Dependencies are inferred from the claim text.