Modified resin systems suitable for liquid resin infusion
AssigneeCytec Industries Inc.
InventorsJonathan E. MEEGAN, Olivia DENMAN, Marco AURILIA
Life of this patent
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Abstract
A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80′ C. to about 130′ C.
Claims27
A liquid resin infusion (LRI) manufacturing process for producing a molded article, comprising the steps of providing a curable composition, injecting said curable composition into a mold, and curing said curable composition, wherein the curable composition comprises:
- a) no more than 5.0 wt % of a thermoplastic polymer:
- b) no more than 5.0 wt % of core-shell particles wherein said core-shell particles have a particle size in the range of from about 50 nm to about 800 nm:
- c) no more than 5.0 wt % of inorganic particles wherein said inorganic partides have a particle size in the range of from about 2.0 nm to about 800 nm;
- d) an epoxy resin component which comprises one or more epoxy resin precursor(s):
- and
- e) one or more amine curing agent(s),
- wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80′ C. to about 130° C.
A curable composition comprising:
- a) no more than 5.0 wt % of a thermoplastic polymer:
- b) no more than 5.0 wt % of core-shell particles wherein said core-shell particles have a particle size in the range of from about 50 nm to about 800 nm;
- c) no more than 5.0 wt % of inorganic particles wherein said inorganic particles have a particle size in the range of from about 2.0 nm to about 800 nm;
- d) an epoxy resin component which comprises one or more epoxy resin precursor(s):
- and
- e) one or more amine curing agent(s),
- wherein the viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80′ C. to about 130° C.
The curable composition of claim 26, wherein the inorganic particles are silica particles.
Dependencies are inferred from the claim text.