Hot-swappable server with cooling line assembly

A hot-swappable server comprising:

• a chassis;
• a circuit board positioned within the chassis;
• a first processor electrically connected to the circuit board, the first processor comprising a first integrated heat spreader;
• and
• a cooling line assembly comprising:
• an inlet fitting mounted to the chassis proximate a rear side of the chassis, the inlet fitting being a blind-mate fitting;
• an outlet fitting mounted to the chassis proximate the rear side of the chassis, the outlet fitting being a blind-mate fitting, a centerline of the outlet fitting being substantially parallel with a centerline of the inlet fitting;
• and
• a first heat sink module, wherein a bottom surface of the first heat sink module is sealed against an outer surface of the first integrated heat spreader, the first heat sink module comprising:
• a first inlet port fluidly connected to a first inlet chamber;
• a first plurality of orifices fluidly connecting the first inlet chamber to a first outlet chamber;
• and a first outlet port fluidly connected to the first outlet chamber, wherein the first outlet chamber is bounded by a portion of the outer surface of the first integrated heat spreader, and wherein the first plurality of orifices are configured to deliver a first plurality of jet streams of dielectric coolant into the first outlet chamber and against the outer surface of the first integrated heat spreader when pressurized dielectric coolant is provided to the first inlet chamber.

A hot-swappable server adapted to blindly mate to a manifold assembly of a cooling system comprising dielectric coolant, the server comprising:

• a chassis;
• a circuit board positioned within the chassis;
• a first processor electrically connected to the circuit board;
• the first processor comprising a first substrate and a first semiconductor die mounted on a surface of the first substrate;
• and
• a cooling line assembly comprising:
• an inlet fitting mounted to the chassis proximate a rear side of the chassis, the inlet fitting being a blind-mate fitting;
• an outlet fitting mounted to the chassis proximate the rear side of the chassis, the outlet fitting being a blind-mate fitting, a centerline of the outlet fitting being about parallel with a centerline of the inlet fitting;
• and
• a first heat sink module mounted on the surface of the first substrate, the first heat sink module comprising:
• a first inlet port fluidly connected to a first inlet chamber;
• a first plurality of orifices fluidly connecting the first inlet chamber to a first outlet chamber;
• and a first outlet port fluidly connected to the first outlet chamber, wherein the first outlet chamber is bounded by a portion of the first surface of the first substrate, and wherein the first plurality of orifices are configured to deliver a plurality of jet streams of dielectric coolant into the first outlet chamber and against the first semiconductor die when pressurized dielectric coolant is provided to the first inlet chamber.