Housing, method for making the same, electronic device, and automotive interior component

An electronic device comprising:

• a housing comprising:
• a substrate, one surface of the substrate defining a groove, an interior wall of the groove defining at least one through hole passing through the substrate;
• and
• a protective layer formed on an interior wall of the groove and the surface of the substrate beside the groove, and fully attached to the internal wall of the groove.

An automotive interior component comprising:

• a housing comprising:
• a substrate, one surface of the substrate defining a groove, an interior wall of the groove defining at least one through hole passing through the substrate;
• and
• a protective layer formed on an interior wall of the groove and the surface of the substrate beside the groove, and fully attached to the internal wall of the groove.

A method for making a housing comprising:

• providing a substrate, a surface of the substrate defining a groove;
• defining at least one through hole in an interior wall of the groove which passes through the substrate;
• providing a mold including a female mold core and a male mold core, the female mold core and the male mold core cooperatively forming a mold cavity;
• loading the substrate into the mold cavity, to cause a molding surface of the male mold core to be spaced from the surface of the substrate to form a gap therebetween, the gap communicating with the through hole;
• evacuating the mold cavity via the through hole, thereby generating a negative pressure in the gap;
• filling the gap with a molten resin material;
• solidifying the resin material to form a protective layer on the surface of the substrate, the protective layer fully attached to an internal wall of the groove and the surface of the substrate beside the groove;
• and
• separating the substrate with the protective layer from the mold.