Cooling device for electronic components using liquid coolant
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorXavier BAILLIN
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Abstract
Device used for cooling a component, comprising a support to receive a component to be cooled, the support comprising a fluid network in which a liquid will circulate, the network comprising a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane forming a mobile wall of the first cavity and a mobile wall of the second cavity respectively, the device further comprising means of actuation of the first membrane and of the second membrane and a thermal conducting element close to the channel or in contact with the channel (FIG. 6).
Claims19
Device for cooling at least one component comprising:
- a support that will receive on a first face at least one component to be cooled, the support comprising a fluid network inside which a liquid will circulate, the network comprising a first cavity, a second cavity, and at least one first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane forming a mobile wall of the first cavity and a mobile wall of the second cavity respectively,
- an actuating device for actuating the first membrane and the second membrane, configured to enable deformation of the first and/or the second membrane so as to vary the volume of the first cavity and/or the second cavity and to enable displacement of the liquid in the channel, the device further comprising:
- a thermal conducting element close to the channel or in contact with the channel, the thermal conducting element passing through the support from the channel or close to the channel towards a second face of the support opposite said first face, the thermal conducting element having a thermal conductivity higher than the thermal conductivity of the support.
Dependencies are inferred from the claim text.