Package assembly and method for manufacturing the same
AssigneeSilergy Semiconductor Technology (Hangzhou) LTD
InventorsJiaming Ye, Xiaochun Tan
Life of this patent
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Abstract
A package assembly can include: (i) a plurality of electrical components stacked on at least two layers; (ii) a lead frame connected to the electrical components by solder interconnection; (iii) an encapsulating compound overlapping a portion of the lead frame and the electrical components to expose portions of leads of the lead frame from the encapsulating compound; and (iv) a heat sink having a first portion arranged between at least two of the plurality of electrical components on adjacent of the at least two layers, where the heat sink is configured to provide a common heat dissipation path for the electrical components.
Claims15
A package assembly, comprising,
- a) a plurality of electrical components stacked on at least two layers;
- b) a lead frame connected to said electrical components by solder interconnection;
- c) an encapsulating compound overlapping a portion of said lead frame and said electrical components to expose portions of leads of said lead frame from said encapsulating compound;
- and
- d) a heat sink having a first portion arranged between at least two of said plurality of electrical components on adjacent of said at least two layers, wherein said heat sink is configured to provide a common heat dissipation path for said electrical components.
Dependencies are inferred from the claim text.