Low cost high strength surface mount package
AssigneeRSM Electron Power, Inc.
InventorsChing Au, Dennis Zegzula, David Peng
Life of this patent
Estimating the term…
Abstract
A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10:1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate.
Claims20
A hermetically sealed package comprising:
- an electrically insulating substrate having a plurality of apertures, the electrically insulating substrate having an aspect ratio of about 10:1 or greater;
- a plurality of electrically and thermally conductive tabs hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covering each of the apertures;
- and
- a lid hermetically joined to a top surface of electrically insulating substrate, the lid being joined proximate a perimeter of the electrically insulating substrate.
A hermetically sealed package comprising:
- an electrically insulating substrate having a plurality of apertures;
- a plurality of metallization layers formed on a bottom surface of the electrically insulating substrate, with one of the metallization layers proximate a perimeter of each of the plurality of apertures, each of the plurality of metallization layers having a width of at least about 10 mils;
- a plurality of electrically and thermally conductive tabs, at least one tab covering each of the apertures and joined to the attachment layer corresponding to the aperture covered by the tab;
- a frame-like metallization layer formed on a top surface of the electrically insulating substrate, the frame-like metallization layer being proximate the perimeter of the electrically insulating substrate, the frame-like metallization layer having a width of at least about 15 mils;
- and
- a lid joined to the frame-like metallization layer.
A hermetically sealed package comprising:
- an electrically insulating substrate having a plurality of apertures;
- a plurality of metallization layers formed on a bottom surface of the electrically insulating substrate, with one of the metallization layers proximate a perimeter of each of the plurality of apertures;
- a plurality of electrically and thermally conductive tabs, at least one tab covering each of the apertures and joined to the attachment layer corresponding to the aperture covered by the tab;
- a frame-like metallization layer formed on a top surface of the electrically insulating substrate, the frame-like metallization layer being proximate the perimeter of the electrically insulating substrate;
- and
- a formed lid having a generally L-shaped perimeter, with a portion of the perimeter being generally parallel to the top surface of the electrically insulating substrate, the generally parallel portion of the lid being joined to the frame-like metallization layer.
Dependencies are inferred from the claim text.