Addressable objects storage container with interconnect panel
AssigneeMicrodata Corporation
InventorsShengbo Zhu, Su Shiong Huang
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AssigneeMicrodata Corporation
InventorsShengbo Zhu, Su Shiong Huang
Estimating the term…
A storage container and matching cover for storing addressable objects. The storage container has an interconnect panel with a pair of laterally spaced address signal conductors extending vertically along the panel and terminating at the top and bottom edges of the panel in conductive terminal pads. The cover has an interconnect mechanism with spring biased translatable conductive probes positioned to mate with the conductive terminal pads of an upper and lower container when two containers are vertically stacked. The combination of the container and cover eliminates the need for individual USB jumper cables when interconnecting two or more vertically stacked containers. An auto alignment feature ensures that the containers are properly stacked with the terminal pads in contact with the conductive probes.
A storage container for removably storing addressable objects, said storage container including a plurality of walls forming a storage volume with an upper region, and an interconnect panel secured to one of said plurality of walls, said interconnect panel having a top edge and a bottom edge and including a pair of laterally spaced address signal conductors extending between said top edge and said bottom edge and terminating in conductive terminal pads;
For use with an addressable objects storage container having a plurality of walls, an interconnect panel adapted to be secured to one of said plurality of walls, said interconnect panel having a top edge and a bottom edge and including a pair of laterally spaced address signal conductors extending between said top edge and said bottom edge and terminating in conductive terminal pads
For use with a storage container having an interconnect panel with address signal conductors and spaced pairs of upper and lower terminal pads, a cover including an interconnect mechanism secured thereto and having a laterally spaced pair of spring biased translatable conductive probes, the location of said interconnect mechanism on said cover and the spacing of said probes enabling said probes to individually engage the terminal pads of an upper container and a lower container when an upper container and a lower container are stacked in a vertical manner so that address signals present on the address signal conductors of one of the upper container and the lower container are coupled to the address signal conductors of the other one of the upper container and the lower container.
Dependencies are inferred from the claim text.