Electronic module having an electrically insulating structure with material having a low modulus of elasticity
AssigneeInfineon Technologies AG
InventorsToni SALMINEN, Markus DINKEL
Life of this patent
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Abstract
Electronic module comprising at least one electronic chip, an encapsulation structure in which the at least one electronic chip is at least partially encapsulated, an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip, and an electrically insulating structure which is at least partially formed from a material having a low modulus of elasticity, wherein a variation of the value of the modulus of elasticity is at the most 10 GPa in a temperature range between −40° C. and +150° C.
Claims19
Electronic module, comprising:
- at least one electronic chip;
- an encapsulation structure, in which the at least one electronic chip is at least partially encapsulated;
- an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip;
- and
- an electrically insulating structure which is at least partially formed of a material having a low modulus of elasticity;
- wherein a variation of the value of the modulus of elasticity is at the most 10 GPa in a temperature range between −40° C. and +150° C.
Method for producing an electronic module, wherein the method comprises:
- at least partial encapsulating at least one electronic chip with an encapsulation structure;
- forming an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip;
- and
- forming an electrically insulating structure at least partially made of a material having a low modulus of elasticity;
- wherein a variation of the value of the modulus of elasticity is at the most 10 GPa in a temperature range between −40° C. and +150° C.
Dependencies are inferred from the claim text.