Rigid flex board module and the manufacturing method thereof

A manufacturing method for a rigid flex board module, comprising:

• providing a rigid flex initial substrate including a flexible circuit board, a pair of release layers, a first rigid substrate, and a first insulating layer;
• wherein the flexible circuit board having a bending portion and a jointing portion connected to the bending portion, the pair of release layers respectively disposed on two sides of the flexible circuit board covering the bending portion, the first rigid substrate arranged above the flexible circuit board and the pair of release layers, the first rigid substrate covering the bending portion and the jointing portion, and the first insulating layer connected between the first rigid substrate and the flexible circuit board;
• forming a pair of first openings on the rigid flex initial substrate to expose the bending portion;
• forming a second opening through the rigid flex initial substrate, the first rigid substrate and the first insulating layer;
• disposing a high-density interconnected circuit layer in the second opening;
• forming a pair of multi-layer circuit layers on two sides of the rigid flex initial substrate and covering two sides of the high-density interconnected circuit layer and the rigid flex initial substrate;
• and
• forming a plurality of conductive posts such that the multi-layer circuit layers, the high-density interconnected circuit layer, and the rigid flex initial substrate are electrically connected to each other.