Electronic module and the fabrication method thereof
AssigneeCyntec Co., Ltd.
InventorsChun-Tiao Liu, BAU-RU LU
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Abstract
An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding disposed on the plurality of electronic components and, in further embodiments, the heat sink.
Claims20
An electronic module, comprising:
- a substrate;
- a first plurality of electronic components embedded inside the substrate;
- and
- a second plurality of discrete electronic components electrically connected to a first side of the substrate.
An electronic module, comprising:
- a substrate;
- a first plurality of electronic components embedded inside the substrate;
- a second plurality of electronic components electrically connected to a first side of the substrate;
- and
- at least one third electronic component disposed on a recesses on a second side of the substrate.
An electronic device, comprising:
- an inductor having a body;
- a heatsink, wherein at least one part of the heatsink is disposed on a surface of the body of the inductor.
Dependencies are inferred from the claim text.