Surface-mount technology devices and related methods
AssigneeSkyworks Solutions, Inc.
InventorAndrew Martin KAY
Life of this patent
Estimating the term…
Abstract
Surface-mount technology (SMT) devices and related methods. In some embodiments, an SMT device can include an electrical element and a plurality of terminals connected to the electrical element. The SMT device can further include a body configured to support the electrical element and the plurality of terminals. The body can have a rectangular cuboid shape with a length, a width, and a height that is greater than the width. The body can include a base plane configured to allow surface mounting of the SMT device. In some embodiments, the SMT device can be, for example, a capacitor, an inductor, or a resistor.
Claims20
A surface-mount technology (SMT) device comprising:
- an electrical element;
- a plurality of terminals connected to the electrical element;
- and
- a body configured to support the electrical element and the plurality of terminals, the body having a rectangular cuboid shape with a length, a width, and a height that is greater than the width, the body including a base plane configured to allow surface mounting of the SMT device.
An electronic module comprising:
- a packaging substrate configured to receive a plurality of components;
- a semiconductor die mounted on the packaging substrate, the semiconductor die including an integrated circuit;
- and
- one or more surface-mount technology (SMT) devices mounted on the packaging substrate, each SMT device including an electrical element and a plurality of terminals connected to the electrical element, the SMT device further including a body configured to support the electrical element and the plurality of terminals, the body having a rectangular cuboid shape with a length, a width, and a height that is greater than the width.
A wireless device comprising:
- a transceiver configured to generate a radio-frequency (RF) signal;
- an RF module in communication with the transceiver and configured to process the RF signal, the RF module including a packaging substrate configured to receive a plurality of components, the RF module further including a semiconductor die mounted on the packaging substrate, the semiconductor die including an integrated circuit, the RF module further including one or more surface-mount technology (SMT) devices mounted on the packaging substrate, each SMT device including an electrical element and a plurality of terminals connected to the electrical element, the SMT device further including a body configured to support the electrical element and the plurality of terminals, the body having a rectangular cuboid shape with a length, a width, and a height that is greater than the width;
- and
- an antenna in communication with the RF module, the antenna configured to facilitate transmission of the processed RF signal.
Dependencies are inferred from the claim text.