SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING THE SoP

A system-on-package (SoP) comprising:

• a printed circuit board (PCB);
• and
• discrete active and passive electronic components mounted to the PCB apart from one another, each of the components being electrically connected to at least one other of the components by the PCB,
• wherein the PCB has first and second opposite sides, and comprises a substrate and electrically conductive paths extending through the substrate from the first side to the second side,
• the active electronic components comprise a first chip disposed on the first side and attached to the PCB, and a second chip disposed on the second side of and attached to the PCB,
• the first chip is electrically connected to the electrically conductive paths of the PCB,
• the SoP has interconnections comprising conductors disposed on the substrate of the PCB at the second side thereof and electrically connected to the electrically conductive paths,
• the second chip is attached to the PCB by the conductors, and is electrically connected to the electrically conductive paths by at least some of the conductors so as to be electrically connected to the first chip via the electrically conductive paths, whereby the conductors can be used to test the first chip before the second chip is attached to the PCB.