Semiconductor device

A semiconductor device comprising:

• a first ceramic substrate;
• a second ceramic substrate;
• an inter-ceramic metal having an intermediate portion interposed between an upper surface of the first ceramic substrate and a lower surface of the second ceramic substrate, a first outer edge portion extending outward beyond an outer edge of the second ceramic substrate as viewed in plan, the first outer edge portion being connected to the intermediate portion, and a second outer edge portion extending outward beyond an outer edge of the second ceramic substrate as viewed in plan, the second outer edge portion being connected to the intermediate portion;
• a circuit pattern formed of a metal on the second ceramic substrate;
• a semiconductor element provided on the circuit pattern;
• a first conductor electrically connecting the semiconductor element and the first outer edge portion;
• and
• a second conductor connected to the second outer edge portion.

A semiconductor device comprising:

• a first ceramic substrate;
• a second ceramic substrate;
• an inter-ceramic metal having an intermediate portion interposed between an upper surface of the first ceramic substrate and a lower surface of the second ceramic substrate, a surmounting portion formed on an upper surface of the second ceramic substrate, a connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the surmounting portion, and an outer edge portion extending outward beyond an outer edge of the second ceramic substrate as viewed in plan, the outer edge portion being connected to the intermediate portion;
• a circuit pattern formed of a metal on the second ceramic substrate;
• a semiconductor element provided on the circuit pattern;
• a first conductor electrically connecting the semiconductor element and one of the surmounting portion and the outer edge portion;
• and
• a second conductor connected to the other of the surmounting portion and the outer edge portion.