Package-level electromagnetic interference shielding structures for a substrate

An electromagnetic interference trench-based shielding system, comprising:

• a substrate having one or more surfaces, the substrate being operable to receive one or more microelectromechanical system (MEMS) components;
• one or more laminates operatively attached to the one or more surfaces of the first substrate;
• a first conductive structure spanning a thickness defined by one or more of surfaces of the substrate, the first conductive structure in communication with a trench of the substrate and oriented generally orthogonal to the first substrate;
• wherein the first conductive structure separates at least two MEMS components assembled to the substrate.

A process of fabricating one or more electromagnetic shields between components for ultra-thin radiofrequency packages, the process comprising:

• selectively inserting one or more through package vias (TPVs) in a substrate;
• removing residue from an edge of the one or more TPVs by desmearing;
• electroless seed plating the substrate thereby increasing thickness and conductivity;
• coating the substrate by electrolytic plating with a metal;
• thinning upper and lower surfaces of the substrate;
• laminating upper and lower surfaces of the substrate with a first layer of photoresist film;
• exposing the first layer of photoresist film of the upper and lower surfaces to wavelengths in the ultraviolet spectrum;
• subtractive etching the electrolytic plating on the upper and lower surfaces of the substrate and stripping the photoresist film;
• electroless seed layer plating on the upper and lower surfaces of the substrate;
• applying a relatively a second layer of photoresist film to the upper surface of the substrate, the second layer being thicker than the first layer of photoresist film;
• exposing the second layer of photoresist film to wavelengths in the ultraviolet spectrum;
• electroplating the second layer of photoresist film with a metal;
• stripping the relatively thick photoresist film and etching the electroless seed layer on the upper surface of the substrate thereby forming one or more electromagnetic interference (EMI) shields in communication with corresponding trenches of the substrate;
• and
• laminating one or more layers to apply uniform pressure to uneven profiles of the substrate caused by the one or more EMI shields.