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US 2016/0113107 A1Published application
Power module
AssigneeDelta Electronics, Inc.
InventorsTao WANG, Zhen-Qing ZHAO, Kai LU, Zheng-Fen WAN, Hai-Bin XU
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Abstract
The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.
Claims20
A power module, comprising:
- a first substrate comprising a first circuit-patterned layer;
- a first power chip;
- a first bonding material bonding the first power chip to the first circuit-patterned layer;
- and
- at least one first spacer employed as supports between the first circuit-patterned layer and the first power chip.
2 more elements
Dependencies are inferred from the claim text.