Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

A system to provide electrostatic discharge protection to an integrated circuit (IC) package comprising:

• a loadboard assembly electrically connected to a plurality of input/output channels, the loadboard assembly having a loadboard printed circuit board (PCB) and a plurality of ground pins;
• a socket assembly adapted to accept an IC package having a ball grid array (BGA), the socket assembly having a plurality of interconnection pins coupled to respective ones of the plurality of ground pins, the interconnection pins configured to contact the BGA when the socket assembly accepts the IC package ;
• and
• wherein when the socket assembly accepts the IC package, voltage is forced on ones of the plurality of input/output channels to dissipate charges resident on the IC package to provide electrostatic discharge protection.

A socket assembly comprising:

• a grounding loadboard electrically connected to a plurality of input/output channels;
• and
• a socket case adaptable to accept an integrated circuit (IC) package having a package substrate and a ball grid array (BGA) adjacent the package substrate, the socket case enclosing:
• a conductive plate,
• a socket base, and
• a plurality of pogo pins configured to make electrical contact with the BGA of the IC package,
• wherein the conductive plate includes a conductive material and can mate with any type of socket base.