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US 2016/0112809 A1Published application
Mesh in mesh backplate for micromechanical microphone
AssigneeRobert Bosch GmbH
InventorsJohn W. Zinn, Brett Matthew Diamond
Life of this patent
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Abstract
A MEMS backplate. The MEMS backplate includes a first mesh pattern having a first height and a first arrangement of openings, and a second mesh pattern having a second height and a second arrangement of vent hole apertures. The second mesh pattern is contained within the opening formed by the first mesh pattern.
Claims21
A MEMS backplate, the MEMS backplate comprising:
- a first mesh pattern having a first height and a first arrangement of openings:
- and
- a second mesh pattern haying a second height and a second arrangement of vent holes, the second mesh pattern contained within the opening formed by the first mesh pattern.
Dependencies are inferred from the claim text.