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US 2016/0112013 A1Published application
T-shaped power amplifier cooling plate
AssigneeDaico Industries, Inc.
InventorsRuben X. Mao, Mark White
Life of this patent
Estimating the term…
Abstract
Cooled electronic circuitry may include multiple and substantially parallel circuitry surfaces, each containing power amplifier circuitry, having a side edge, and includes material between at least a portion of the base plate and the side edge that provides a level of thermal conductivity of at least 167 W/m-k; and a cooling plate having a flat surface attached to each of the side edges of the circuitry surfaces in a thermally-conductive manner.
Claims14
Cooled electronic circuitry comprising:
- multiple and substantially parallel circuitry surfaces, each containing power amplifier circuitry, having a side edge, and includes material between at least a portion of the base plate and the side edge that provides a level of thermal conductivity of at least 167 W/m-k;
- and
- a cooling plate having a flat surface attached to each of the side edges of the circuitry surfaces in a thermally-conductive manner.
Dependencies are inferred from the claim text.