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US 2016/0112004 A1Published application
Material for Dissipating Heat From and/or Reducing Heat Signature of Electronic Devices and Clothing
AssigneeLAT Enterprises, Inc., d/b/a MediPak Energy Systems
InventorsLaura Thiel, Carlos Cid
Life of this patent
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Abstract
A material for dissipating heat from and/or reducing the heat signature of electronic devices and clothing is disclosed. In one example, a heat-dissipating and/or heat signature-reducing layer is sandwiched between two substrates, wherein the substrates may be flexible, rigid, or a combination of both flexible and rigid. Further, examples of the heat-dissipating and/or heat signature-reducing layer include anti-static, anti-radio frequency (RF), anti-electromagnetic interference (EMI), anti-tarnish, and/or anti-corrosion materials.
Claims20
An article for dissipating heat comprising:
- a. a heat-dissipating layer;
- and
- b. one or more substrates disposed in close relation to the heat-dissipating layer.
Dependencies are inferred from the claim text.