Semiconductor laser device
AssigneeNichia Corporation
InventorsHideyuki Fujimoto, Masatoshi Nakagaki
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AssigneeNichia Corporation
InventorsHideyuki Fujimoto, Masatoshi Nakagaki
Estimating the term…
A semiconductor laser device comprises a base, a first conductive layer, a second conductive layer, a third conductive layer, and a semiconductor laser chip in this order, each of which has a respective emitting-side end portion. The emitting-side end portion of the first conductive layer is in a common plane with the emitting-side end portion of the base. A thickness of the second conductive layer is greater than a thickness of the first conductive layer. The emitting-side end portion of the second conductive layer is disposed inward of the emitting-end portion of the first conductive layer. The emitting-side end portion of the third conductive layer is in a common plane with the emitting-side end portion of the second conductive layer. The emitting-side end portion of the semiconductor laser chip is disposed outward of the emitting-side end portion of the third conductive layer.
1-24. (canceled)
A method for manufacturing a semiconductor laser device, the method comprising:
Dependencies are inferred from the claim text.