Memory device and manufacturing method therefor

A memory device comprising:

• a substrate;
• a plurality of first conductive wires provided on the substrate and extending in a first direction;
• a plurality of second conductive wires provided on the first conductive wires and extending in a second direction crossing the first direction;
• a memory cell connected between a singularity of the first conductive wire and a singularity of the second conductive wire;
• a first contact connected to at least a part of an upper surface of an end portion of the first conductive wire and at least a part of a side surface of the end portion;
• and
• a second contact connected to an upper surface of an end portion of the second conductive wire and at least a part of a side surface of the end portion of the second conductive wire,
• the end portion of the first conductive wire including a first portion having substantially same width in the second direction and a second portion extending from the first portion and having width in the second direction decreasing toward a distal end of the end portion of the first conductive wire, and
• the end portion of the second conductive wire including a third portion having substantially same width in the first direction and a fourth portion extending from the third portion and having width in the first direction decreasing toward a distal end of the end portion of the second conductive wire.

A manufacturing method for a memory device, comprising:

• forming a first insulating film above a substrate;
• forming, above the first insulating film, a conductive wire including an end portion decreasing in width toward a distal end;
• forming a second insulating film above the first insulating film and the conductive wire;
• etching the second insulating film that overhangs, when viewed from above the conductive wire, a region overlapping the end portion and the first insulating film that overhangs, when viewed from above the conductive wire, a region overlapping the region and not overlapping the conductive wire;
• forming a conductive material on the etched regions;
• and
• planarizing the conductive material to form a contact electrically connected to the end portion at least on a side surface of the end portion,
• the end portion including, in the contact, a first portion having a shortest distance from an outer peripheral surface of the contact and a second portion extending from the first portion and having a distance from the outer peripheral surface of the contact longer than the shortest distance.