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US 2016/0111621 A1Published application
Heat Conversion Device
AssigneeLG Innotek Co., Ltd.
InventorsBoone Won, Jong Bae Shin, Jong Min Lee, Yong Sang Cho
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Abstract
Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.
Claims19
A heat conversion device, comprising:
- a housing;
- a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other;
- a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively;
- and
- a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.
2 more elements
Dependencies are inferred from the claim text.