Light emitting diode package
AssigneeSeoul Semiconductor Co., Ltd.
InventorBang Hyun KIM
Life of this patent
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Abstract
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.
Claims19
A light emitting diode (LED) package, comprising:
- a first lead frame and a second lead frame;
- an LED chip disposed on the first lead frame;
- a wire electrically connecting the LED chip and the second lead frame;
- and
- a housing disposed on the first lead frame and the second lead frame, the housing comprising:
- an external housing surrounding an external cavity;
- and
- an internal housing covering at least a portion of the first lead frame and the second lead frame, and exposing a portion of the first lead frame and the second lead frame in a specified shape.
A light emitting diode (LED) package, comprising:
- an LED chip;
- a first lead frame and a second lead frame electrically connected to the LED chip;
- and
- a housing disposed on the first lead frame and the second lead frame, the housing comprising:
- an external housing surrounding an external cavity;
- and
- an internal housing surrounding an internal cavity and disposed on at least one of the first lead frame and the second lead frame.
Dependencies are inferred from the claim text.