Back to results
US 2016/0111606 A1Published application
Light-emitting device and method of manufacturing the same
AssigneeSeoul Viosys Co., Ltd.
InventorsJun Yong Park, Hee Cheul Jung, In Kyu Park, Daewoong Suh
Life of this patent
Estimating the term…
Abstract
Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over the frame portion so as to cover the light-emitting portion.
Claims17
A light-emitting diode package comprising:
- a frame portion comprising a chip-mounting region defined in an upper portion thereof, and first and second frames spaced apart from each other;
- a light-emitting diode mounted on at least a portion of the chip-mounting region with a bonding layer interposed therebetween;
- and
- a first bonding aid layer formed between the bonding layer and the frame portion.
1 more element
Dependencies are inferred from the claim text.