Method for transferring light-emitting elements onto a package substrate
AssigneePlayNitride Inc.
InventorsYU-CHU LI, YU-HUNG LAI, TZU-YANG LIN
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AssigneePlayNitride Inc.
InventorsYU-CHU LI, YU-HUNG LAI, TZU-YANG LIN
Estimating the term…
A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a supporting substrate and a plurality of light-emitting elements, each of the light-emitting elements being removably connected to the supporting substrate and having a surface opposite to the supporting substrate; disposing the light-emitting unit spacingly above a package substrate in such a manner that the surface of each of the light-emitting elements faces the package substrate; and disconnecting the light-emitting elements from the supporting substrate to allow the light-emitting elements to fall onto the package substrate by gravity, so as to connect the light-emitting elements with the package substrate in a non-contact transferring method.
A method for transferring light-emitting elements onto a package substrate, comprising:
Dependencies are inferred from the claim text.