Light emitting device and method of fabricating the same
AssigneeSeoul Semiconductor Co., Ltd.
InventorsHyuck Jung CHOI, Dae Hee KIM
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Abstract
A method of fabricating a light-emitting device, the method including forming a first resin comprising a phosphor inside a cavity of a package body on which a light-emitting diode chip is mounted, measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor, and correcting the color coordinates by forming a second resin on the first resin. The first resin is not fully cured before measuring and correcting the color coordinates.
Claims19
A method of fabricating a light-emitting device, the method comprising:
- forming a first resin comprising a phosphor without curing inside a cavity of a package body on which a light-emitting diode chip is mounted;
- measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor;
- and
- correcting the color coordinates by forming a second resin on the first resin.
A method of fabricating a light-emitting device, the method comprising:
- depositing a first resin comprising a phosphor inside a cavity of a package body on which a light-emitting diode chip is mounted;
- allowing the phosphor of the first resin to settle around the light-emitting diode chip alter depositing the first resin on the light-emitting diode chip;
- measuring color coordinates of light emitted by combination of the light emitting diode chip and the phosphor;
- and
- correcting the color coordinates by forming a second resin on the first resin.
Dependencies are inferred from the claim text.