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US 2016/0111589 A1Published application
Low-cost solar cell metallization over tco and methods of their fabrication
AssigneeSunpreme, Ltd.
InventorsAshok Sinha, Roman Milter, Robert Broesler
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Abstract
Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
Claims20
A method for fabricating a solar cell, comprising:
- texturing a front surface of a silicon wafer;
- fabricating a photovoltaic structure over the front surface of the silicon wafer;
- fabricating a transparent conductive oxide (TCO) layer over the photovoltaic structure;
- and,
- fabricating front metallization layer in electrical contact with the TCO, by electroplating a copper layer or an alloy with 50% or more of copper.
2 more elements
Dependencies are inferred from the claim text.