Encapsulated flexible electronic device, and corresponding manufacturing method
AssigneeSTMicroelectronics S.r.l.
InventorsCorrado ACCARDI, Stella LOVERSO, Sebastiano RAVESI, Noemi Graziana SPARTA
Life of this patent
Estimating the term…
Abstract
The disclosure relates to an encapsulated flexible electronic device comprising a flexible electronic device, wherein the flexible electronic device is protected by a protective coating layer, a first cover sheet and a second cover sheet being made of patterned and developed dry photoresist films. The encapsulated flexible electronic device may be used to directly realize different type of electronic devices, such as smart sensor devices.
Claims20
A method for manufacturing an encapsulated flexible electronic device, the method comprising:
- forming a protective coating layer on a flexible electronic device;
- forming a first cover sheet on the flexible electronic device;
- forming a second cover sheet on the flexible electronic;
- and
- patterning and developing each of the protective coating layer, the first cover sheet, and the second cover sheet, each of the protective coating layer, the first cover sheet, and the second cover sheet being a dry photoresist film.
A method for manufacturing an encapsulated electronic device, the method comprising:
- laminating a first dry photoresist film on a first surface of an electronic device;
- laminating a second dry photoresist film on a second surface of the electronic device;
- and
- laminating a third dry photoresist film on the first dry photoresist film.
The method according to claim 12 wherein the first dry photoresist film is a negative tone and transparent dry photoresist film, and forming the pattern in the first dry photoresist film includes exposing the first dry photoresist film to ultraviolet light that passes through a photolithographic mask.
A method for manufacturing an encapsulated flexible electronic device, the method comprising:
- placing a first dry photoresist film on a first surface of an electronic device;
- placing a second dry photoresist film on a second surface of the electronic device;
- placing a third dry photoresist film on the first dry photoresist film;
- and
- curing the second dry photoresist film and the third dry photoresist film.
Dependencies are inferred from the claim text.