Absorber surface modification
AssigneeTSMC Solar Ltd.
InventorShih-Wei CHEN
Life of this patent
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Abstract
The present disclosure provides systems and methods for depositing an alkaline metal layer on an absorber to generate a copper-poor region at a surface of the absorber. The copper-poor region provides an increased efficiency over non-treated absorbers having copper-rich surfaces. The alkaline metal layer may be deposited by any suitable deposition method, such as, for example, a wet deposition method. After the alkaline metal layer is deposited, the absorber is annealed, causing the alkaline metal layer to interact with the absorber to reduce the copper-profile of the absorber at the interface between the alkaline metal layer and the absorber.
Claims20
A method for forming a photovoltaic cell, comprising the steps of:
- forming an absorber on a back electrode;
- depositing a material comprising an alkaline metal on a surface of the absorber;
- and
- annealing the absorber to reduce a copper content of the absorber at the surface.
A system, comprising:
- a sprayer configured to deposit an alkaline metal solution onto a surface of an absorber;
- an annealing chamber configured to anneal the absorber and the alkaline metal solution;
- and
- a controller configured to control the sprayer and the annealing chamber, wherein the controller is configured to activate the annealing chamber a predetermined period after the alkaline metal solution is deposited.
A system, comprising:
- a dip tank having an alkaline metal solution therein, the dip tank configured to receive an absorber therein, wherein an alkaline metal layer is deposited on the absorber by the dip tank;
- an annealing chamber configured to anneal the absorber and the alkaline metal layer;
- and
- a controller configured to control the annealing chamber, wherein the controller is configured to activate the annealing chamber a predetermined period after the alkaline metal solution is deposited.
Dependencies are inferred from the claim text.